PROGRAMS & EVENTS

- Semiconductor Technology Programs
  Committee (STC)

- European Manufacturing Test
  Conference (EMTC) Committee

- Fab Managers Forum Committee

- International MEMS/MST Industry
  Forum Committee

- Advanced Packaging Conference
  Committee

Semiconductor Technology Programs Committee (STC)

Michael Arnold, PEER Group

Johann Bartha, TU Dresden

Tom Beens, Umicore

Jacques Berg, Tokyo Electron

Livio Baldi, Micron

Bernie Capraro, Intel Ireland Ltd

 Johan, Dekoster, imec

Guy Dubois, GDCL Management

(co-chair)

Ernst Feistle, Applied Materials

Mart Graef, TU Delft (co-chair)

Martin Heerschop, Solutions-On-Silicon

Didier Louis, CEA-Leti

Martin McCallum, Nikon

Richard Oechsner, Fraunhofer IISB

Lothar Pfitzner, Fraunhofer IISB

Ivo Raaijmakers, ASM International

Peter Schaeffler, Texas Instruments

Karsten Schneider, Applied Materials

Lutz Labs, Infineon

Fabrice Letertre, Soitec

Joachim Pelka, Fraunhofer

Philippe Campion, STMicroelectronics

International MEMS/MST Industry Forum Committee

Jérémie Bouchaud, iSuppli (vize-chair)

Karl-Friedrich Becker, Fraunhofer

Gerhard Lammel, Bosch (co-chair)

Paul Lindner, EVG

Christian Schaefer, PVA Tepla

 Ulrike Schömbs, Suss MicroTec

Uwe Schwarz, X-Fab

Thomas Gessner, Fraunhofer

 Frédéric Breussin, Yole Developpement

Martina Vogel, Fraunhofer ENAS

Anna-Riikka Vuorikari-Antikainen, Okmetic

Marc Osajda, Freescale

Ignas van Dommelen, Sencio

SEMICON Europa conference

Networking

Advanced Packaging Conference Committee

 Rolf Aschenbrenner, Fraunhofer IZM

Eef Bagerman, NXP

 Eric Beyne, imec

Andreas Fischer, Bosch

Andy Longford, PandA Europe (co-chair)

Jens Mueller, IMAPS Europe Chapter

Steffen Kroehnert, Nanium (co-chair)

Thomas Oppert, PAC TECH
 Amandine Pizzagalli, Yole

Klaus Pressel, Infineon

Klaus Schrimper, Hesse-Knipps

Michel Garnier, STMicroelectronics

Albert Koller, Oerlikon

European Manufacturing Test Conference (EMTC) Committee

Davide Appello, STMicroelectronics

Conceicao Caldeira, Infineon

 Peter Cockburn, Itxc

Stefan Eichenberger, NXP

 Piergiorgio Galletta, Micron

Stefan Gasteiger, Advantest

Ana Leao, Nanium

 Klaus-Detlef Paesch, GLOBALFOUNDRIES

Chris Portelli-Hale, STMicroelectronics (co-chair)

 James Quinn, Multitest

René Segers, ReSeCo (co-chair)

Paul van Ulsen, Salland

SEMICON Europa Executive Summit

Fab Manager Forum Committee 

Philippe Campion, Operations Manager, STMicroelectronics

Günther Ernst, COO, LFoundry

Riccardo Martorelli, Site Manager, Micron Technology Italia

Detlef Nagel, Manager Product Line BiMOS Chips, ABB Switzerland, Semiconductors

Peter Schaeffler, Manufacturing Manager, Texas Instruments Deutschland

Johannnes Sturm, Infineon

Mario von Podewils, Manager Operations, X-Fab Erfurt

Thorsten Widmer, Fab Manager, Robert Bosch (chairman)