Abstracts and Biographies

• KEYNOTE: Trends for Automotive Micromechanical Sensors
• KEYNOTE: Revolution and Evolution of Consumer MEMS Applications
• KEYNOTE : “How to make and use MEMS for all applications”
• Micro- and Nanotechnologies in Mobile Digital Solutions
• Leveraging Microfluidics from inkjet printheads ICs into portable DNA testing
• MEMS Accelerometers Replace High-End Electromechanical Devices
• Smart Sensor Hub
• KEYNOTE: Monolithic to Multi Chip: Smart Partitioning Adds Customer Value
• Business and Technical Challenges for High-Volume MEMS Foundries
• Test in Carrier for Cost Effective Final Test of MEMS
• Introduction of a Vertical Pressure Sensing Cell Array
• Process Separation for Enhanced Throughput and Reduced Cost Wafer to Wafer Bonding
• Integration of MEMS sensors with complex CMOS circuitry on 200mm Si wafers
• Emerging MEMS Applications are Driving the Growth for the Next 5 Years
• MEMS Back to Double Digit Growth

SESSION 1: MEMS Applications

KEYNOTE: Trends for Automotive Micromechanical Sensors

Abstract

Micromechanical sensors for automotive applications – this is a 20-year success story. MEMS for automotive started in the eighties of the last century with first micromechanical pressure sensors, and proceeded with mass flow and acceleration sensors and – last but not least – with gyroscopes. The market has reached a volume of about 1.5 billion USD and is the largest market for MEMS sensors. It shows an impressive growth of over 9% per year.  Looking into the details there are several trends which are important in order to understand the increasing market penetration of MEMS sensors:
1. Legislation
Several legislations are pushing the penetration of systems using MEMS sensors. Examples are the mandates for ESP and TPMS in Europe or stronger exhaust gas regulations throughout the world. 

2. Cost reduction
The continuous reduction of sensor costs is the main driver for the penetration of MEMS containing systems from luxury class vehicles to medium class vehicles and compact cars. Besides the “classical shrink” there are various ways to reduce costs:

• Integration of various sensor types into one package
• Integration into ECU
• Cost-efficient interfaces 

3. Broadened application range
Improvements in MEMS technologies are enabling the use of MEMS sensors for a broader application range.  The talk will give an overview of MEMS technology, give short insights into the history of MEMS in automotive and present several new product concepts. 

Biography

KEYNOTE: Revolution and Evolution of Consumer MEMS Applications

Abstract

This presentation will address the current status of MEMS sensor integration in mobile devices by highlighting the most frequent use cases and subsequent sensor requirements. Further the evolution of MEMS sensor integration in mobile devices will be projected based on overall system optimization aspects.
Some of the addressed aspects:
Current MEMS accelerometer context in mobile phones – product adaptation industry learning curve
Evolution of use cases – new sensor type introduction, from technology push to market pull.
Which are the prerequisites for being successful in this market and how to align a relative complex product/technology development process with fast changing market requirements?
MEMS sensors will be omnipresent in the future, spreading from mobile phones to other portable devices, but this evolution will not be a smooth carry-over. Adapting to specific device & use case requirements will be the key to spark this market.
Bosch Sensortec is a subsidiary of the Bosch Automotive Division focusing specifically on consumer electronics applications for MEMS inertial & pressure sensors.
While Bosch is leading the MEMS sensor market globally, Bosch Sensortec achieved a leading position in consumer accelerometers within a very short period of time. Technology leadership and customer focus are the main ingredients for this outstanding success story.  

Biography

KEYNOTE

Abstract

Biography

Keynote: “How to make and use MEMS for all applications”

Abstract

Since more than 25 years EPCOS is producing Surface Acoustic Wave Filters in high volumes. The technical base is same as needed for cost efficient and reliable MEMS devices as for example pressure sensors, microphones and RF MEMS. This keynote will explain how to make such components and how to use them in all applications like navigation, communication, automotive, etc.. Special focus is the packaging and how to make such MEMS packages ultra small in terms of size and height.

Biography

Micro- and Nanotechnologies in Mobile Digital Solutions

Abstract

Mobile communication and the Internet have converged into a global information platform. Mobile solutions based on powerful mobile devices and digital online services enable location and context based services, virtual social networks, content creation and distribution, interacting with local environment, carrying the digital identity of the user and enabling easy-to-use secure communication and controlled privacy and sensing local context and the behaviour of the user. We will discuss the major related and foreseen changes in mobile device technologies, focusing on sensing, cognitive radio and transformable devices based on nanotechnologies. Sensing is already a key feature of various battery powered, hand-held devices. Especially, location, motion and gesture recognition are new pervasive elements of applications, user interfaces and services. The requirements of consumer electronics, especially of sport gadgets, mobile phones and game controllers, have driven the miniaturization of MEMS devices. Today MEMS and CMOS technologies provide a solid basis for large scale deployment of sensor applications. The opportunity to connect locally measured information to Internet services and to incorporate this local information into structured global information might be even more significant. Example of benefits include real time tracking of the spread of a disease or epidemic or interpretation of changes in traffic patterns on roads through a combination of local sensors and the Internet. The Internet is becoming a massive store of heterogeneous data and linked information. Extremely efficient search and data mining technologies are creating a dynamic and real time map of the physical world with its various business and social networks. Cognitive radio can be defined as a radio system that has capabilities to obtain knowledge of radio operational environment, monitor usage patterns and user needs, dynamically adjust its operational parameters and protocols for more efficient performance and spectrum utilization, and to learn from results of its action to improve the performance. Next generation local area access solutions will converge into intelligent and flexible solutions based on cognitive radio. Another important development is the integration of wireless sensors and tags into various objects of our everyday devices, the Internet of Things. Manufacturing and logistics of goods are the natural starting point of distributing digital identity and communication capability to physical objects. However, this profound capability links the artifacts to the Internet via various mobile and axed gateways. Consequently, consumers will benefit of various possible digital services that are linked to their everyday physical objects. Cognitive radio and the Internet of Things set new requirements for future devices and their radio solutions. First of all, future devices need to be able to measure the surrounding radio spectrum. Secondly, they need to dynamically adapt to the changes in the radio environment. Implementation requires power efficient spectrum analysis together with machine learning algorithms. Furthermore, the radio front-end requires efficient tunable components. Nokia's Morph concept device is transformable in many different ways. The user interface of the device can adapt to the context of the user in terms of functionality and appearance. Transformability can be used to enable the ease of use of the device, applications and services.
The Morph device is transformable in its form and conformation. The Morph is a cognitive user interface, capable of sensing both the user and the environment, making decisions based on this information, adapting to the context and give feedback to the user. The Morph learns about its user and becomes a trusted personal companion. Interfaces of future devices with the physical world and their users require new type of intelligent and energy efficient sensors and actuators that can benefit of development of low cost electronics manufacturing and functional materials. Open innovation may have a crucial role in the development of nanotechnologies and products based on them. Bringing the necessary competences together requires new type of collaboration between various academic and industrial partners.

Leveraging Microfluidics from inkjet printheads ICs into portable DNA testing

Abstract

MEMS based microfluidic technology has been successsfully applied to printhead ICs for many years as a building block of today's consumer inkjet printers. Its performance improvements over time have enabled today's impressive print speed combined with true photo quality prints. As printhead technology matures, companies are leveraging this know-how into new emerging applications. ST has successfully done that in developing "In-Check", a highly integrated platform for DNA testing at the point of need. The consumable part of "In-Check" is built around an innovative microfluidic chip. This chip will extend DNA testing in healthcare, food and environmental to levels of higher speed and lower cost which cannot be achieved with traditional methods

Biography

MEMS Accelerometers Replace High-End Electromechanical Devices

Abstract

MEMS accelerometers penetrate more and more markets and applications so far dominated by classical electromechanical devices such as electromechanical accelerometers or geophones. MEMS devices start to meet the same or even higher performances levels at a significantly lower cost and with increased robustness and reduced size.
Target applications for high-end MEMS applications are:

• Navigation and guidance in aeronautics and defense Markets
• Earthquake monitoring
• Down-hole drilling
• Seismic imaging

All these applications require high resolution typically 22 to 24 bit, low noise, high bias stability, typically 1 to 10 ppm bias stability and high linearity, up to -100 dB total harmonic distortion.
MEMS technology meets these requirements and is a cost efficient alternative to the classical devices. Furthermore it offers advantages in terms of robustness, power consumption, size, performance and ease of use, providing directly a 24 bit digital signal, all critical analog electronics being part of the sensor module.
High resolution accelerometers where initially developed for seismic imaging applications where they are already in large scale use. In seismic imaging MEMS devices surpass the traditional geophones in terms of image quality thanks to 3 axis signal acquisition. The key success factors to penetrate these applications is a low noise, high stability MEMS sensor combined with a high resolution Sigma Delta servo technology. This technology is now being adapted to meet the stringent stability requirements for tilt and navigation applications.
At Colibrys this technology is implemented using bulk micro machined MEMS out of plane MEMS devices allowing reaching the required low Brownian noise levels and the high sensor gain. For the servo loop a concept is used with a minimal constant of analog electronics, and digital signal processing yielding directly a digital output.

These high-end accelerometers constituent a growing market for medium volume, added value MEMS products by replacing the current electromechanical devices.

Biography

Smart Sensor Hub

Abstract

The first major application for MEMS sensors in mobile phones was the addition of an accelerometer for portrait / landscape attitude determination. The calculation of phone attitude from raw accelerometer readings is a trivial task requiring low sampling rate and the phone applications processor was able to incorporate these algorithms with ease. 
The latest uses of MEMS sensors, for applications such as gesture user interfaces, e-Compass and dead reckoning navigation, differ in three key areas: i) the algorithms fuse data streams from multiple sensor types, ii) the data sampling rates may be up to 100Hz and iii) the processing performed involves greater computational complexity. It is expected therefore that the market will move towards the concept of a 'smart sensor hub' where a low power processor embedded within one of the sensor elements both controls the remaining sensors and implements the sensor fusion algorithms. The applications processor is then able to extract quality processed data from the sensor hub with minimal overhead. The challenge and opportunity to MEMS sensor providers is to recognize this trend and implement value-add algorithms within the sensor framework.

Biography

SESSION 2: Manufacturing Strategies and Challenges

KEYNOTE: Monolithic to Multi Chip: Smart Partitioning Adds Customer Value   

Abstract

Analog Devices Inc. has been a provider of MEMS devices used in many applications and industries. Initial product development included airbag sensing devices for automotive applications, a market requiring high quality, high volume, and low pricing.
In 1991 MEMS hit the market with the first volume application, airbag sensors fabricated using a monolithic MEMS surface micromachining process. The proprietary fabrication process allowed both the MEMS sensor and the support electronics to be integrated into a single die. At that point in time the multichip approach was cost prohibitive for this market, i.e. packaging costs were quite high. The cost model for a monolithic device was simple, die cost, package cost, assembly cost, and the cost of testing.
The advantages and disadvantages of a monolithic approach will be discussed. On the plus side the wafer and package costs remained predictable. On the minus side was the ability to make and validate sensor or circuit changes in a timely manner. Small changes would result in “minor” new products, requiring full analysis and release.
As the cost of multichip packaging became more attractive, ADI opted to make a significant change in the MEMS manufacturing process, dividing the MEMS sensor and electronics into separate die. The cost modeling of this approach will also be discussed. Package interactions and multi wafer approach posed a new set of challenges, but also brought additional benefit. Multichip packaging such as multi chip module (MCM) technology originally developed for its Mil Aero business will also be discussed. In this configuration, accelerometers, gyroscopes, magnetometers, and all the necessary high performance signal processing can be offered in a single package.

Biography 

Business and Technical Challenges for High-Volume MEMS Foundries

Abstract

The microelectromechanical systems (MEMS) technology trend of progressing to larger wafer diameters to drive down die costs parallels the CMOS trend of moving to larger wafer sizes. However, integrating MEMS into monolithic CMOS circuits – especially those at advanced 8-inch CMOS sizes – poses distinct business and technical challenges as well as benefits.
Prior to addressing the technical challenges of integration, the MEMS application itself must be developed. The business implications of doing this are daunting, because certain volume levels are required to justify the cost of developing a process and installing 8-inch manufacturing capabilities. Unlike the CMOS business model, little standardization exists on the highly customized MEMS side. With no established ecosystem or design flows, developing a working MEMS design requires more effort. The CMOS supply chain is mammoth – driven by a multitude of IDMs, foundries, fabless suppliers, packaging houses and testing houses – resulting in a $230B market with silicon content exceeding $100B. In contrast, the focused MEMS industry is about a $6B market with silicon content of only $1.5-$2B. Such volume does not intuitively force a move to 8-inch wafers, yet, while most production still sits on 4-, 5- and 6-inch wafers, MEMS volume manufacturing is being established on the 8-inch size.
Integrating MEMS in a CMOS environment also poses difficult technical challenges, given that the requisite manufacturing techniques often are incompatible. Chemicals used in MEMS manufacturing often are atypical or even hostile in the CMOS manufacturing environment, necessitating separate manufacturing facilities or at least separate areas within the plant. The mechanical properties of MEMS layers are often not considered in the CMOS environment. For example, stress or sheet resistances are different for MEMS than for CMOS devices.
This paper will examine both business and technical challenges of MEMS integration in monolithic circuits from a pure-play foundry perspective.

Biography

Test in Carrier for Cost Effective Final Test of MEMS

Abstract

Issue:
Test and calibration is becoming the biggest cost driver at MEMS manufacturing with the integration of various MEMS sensor applications within one package. The application specific unique mechanical stimulus requirements are enforcing this negative cost development in addition to other requirements like temperature test and package modifications.
Solution:
The new test concept - ‘Test in carrier’ – reduces the cost of test tackling the key cost driving parameters: Highest test parallelism with highest OEE at all temperatures and full package convertibility from large packages down to 1x1mm WSP wafer scale packages.
Robust handling at 1/500.000 jam rates for smallest devices outperforms traditional test handling concepts. Highest multi site factor of  i.e. 144 units parallel is scaling the cost down.
The ‘test in carrier’ can get applied for almost all MEMS applications such as 3 axis Gyroscopes, 3 axis Accelerometers and 3 axis Magnets, as well as Microphones, Pressure sensors and many others emerging MEMS. However, the combination of the mechanical stimulus applications within one system is finally providing another significant advantage compared to common test concepts in the market. 

Biography

SESSION 3: MEMS Technologies Process

Introduction of a Vertical Pressure Sensing Cell Array

Abstract

Even though pressure sensor systems are ranked to be among mature technologies, the low-cost monolithic integration into a CMOS technology poses a difficult task. As the systems enter consumer products, the pricing pressure forces market players to continuously watch out for innovative integration concepts. Common technologies, as the Venice concept or the poly-silicon plate capacitive sensor do not scale down with the technology node of the host ASIC. Therefore, the relative area consumption of integrated sensor structures rises with progressing ASIC nodes.

In this contribution, a new technology for integrated pressure sensors is introduced. The vertical pressure sensitive element is created by a deep trench etch process. The high aspect ratio reactive ion etch sequence produces arrays of lamellas that are formed within the silicon substrate. These structures undergo a subsequent doping and sealing sequence. After completion of the modular sensor manufacturing process a standard CMOS or eFlash process can subsequently be applied. Pressure ports may be established to the chip front or back side or even to the dicing edges. Thus, also a differential pressure sensor can be fabricated without any additional effort.

The manufacturing process sequence has been tested on a barometric sensor application. Compared to common micromechanical layout concepts an effective area shrink by a factor of twenty has been achieved.

Biography

Process Separation for Enhanced Throughput and Reduced Cost Wafer to Wafer Bonding

Abstract

Wafer bonding has been an enabling technology for the production and use of MEMS devices by providing zero level packaging or capping of environmentally sensitive devices since the inception of MEMs. However this enabling technology comes with a significant price tag. The fundamental challenge with wafer to wafer bonding is that it is a serial process; other challenges are that the processes are often slow and usually require specialized alignment and bonding equipment. The time for the bonding process is typically driven by two primary factors: the process temperature along with associated temp ramp rates and the time at which the wafers must be held at the process temperature. In order to reduce process time and therefore process costs much work is being done tp lower temperature process such as UV initiated polymers and transient liquid phase (TLP) metal bonding. However some cases metal bonds which require a high process temperature are required or high vacuum levels are needed forcing extended pump down times.. In these cases process separation of load, preheat, and initial pump down from the peak process temperature, high force and deep vacuum and finally a cool down phase can allow a higher throughput and lower cost of ownership.

Biography

Integration of MEMS sensors with complex CMOS circuitry on 200mm Si wafers 

Abstract

A professionally managed and automotive certified 200mm CMOS factory is used as the base for the realization of MEMS sensors with complex CMOS circuitry. After finishing the CMOS process with a CMP planarization of the final dielectric, the sensor steps are executed in a separate clean room which allows for steps which are not compatible with the CMOS factory. An example of this approach is the realization of an uncooled infrared focal plane array (IRFPA) for thermal imaging applications in the far infrared range with a VGA resolution of 64Ҁ pixel. The IRFPA combines an array of bolometers as the IR-sensitive elements, a complex readout circuitry using standard CMOS technology, and a chip-scale vacuum package. The bolometer is constructed with low temperature process steps on top of a CMOS substrate. Low temperature deposition, etch and release processes are employed for the sensor construction in order to avoid changes in the characteristics of the CMOS devices. The necessary vacuum tight package is realized by employing the soldering of IR transparent lids with antireflective coatings to the CMOS wafer via electroplated Cu/Sn frames. A flip chip bonder and a vacuum soldering station are utilized for this step. The functionality of the CMOS/sensor combination has been demonstrated.
For sensor applications which need high temperature steps for the functionality of the sensor, a wafer bonding process has been developed and an infrared sensitive diode device has been realized.
The existing 300m² clean room is being extended to 600m² with additional capabilities which will enable 3D interconnects via TSVs, highly accurate front side to back side alignment, conformal deposition processes, ion beam etching, uniform wafer thinning, and other process options along with the necessary process control tools. The flexibility in choosing process options allows Fraunhofer IMS to tackle projects for very sensitive CMOS camera sensors, special pressure sensor concepts, color sensitive camera sensors, biohybrid sensorsystems, and other microsystems.

Biography

SESSION 4: MEMS Market Review

Emerging MEMS Applications are Driving the Growth for the Next 5 Years

Abstract

Biography

MEMS Back to Double Digit Growth

Abstract

MEMS is back on fast track with double digit growth from 2010 to 2014 after having experienced its first recession in 2008 - 2009.

The automotive MEMS market for example is rebounding spectacularly early 2010 with most sensor suppliers reaching again the high level marks of 2007. Not only safety mandates like TPMS in Europe after 2013 or ESC in the US and Europe boost the market, the Chinese market is also a new factor of growth especially for powertrain applications.

The consumer and mobile phones markets confirm its role as new locomotive of the MEMS fast train. In 2009, 28% of the phones featured an accelerometer, up from 10% in 2008. Gyroscopes are appearing in first smart phones in 2010 and noise suppression boosts the MEMS microphone market as it drives adoption of dual microphones in phones.

Finally, high value market in medicine, instrumentation defence and aeronautics continue to be a fertile ground for over 100 suppliers of MEMS sensors, from MEMS gyroscopes which gradually displace their fiber optic counterparts to microbolometers for predictive maintenance, building inspection of surveillance applications.

Fast growth comes along with a strong price pressure and iSuppli will show how innovation e.g. on packaging enables to defend margins in that dynamic market.

Biography