SEGMENTS

In the pursuit of building more functionality into ever-shrinking silicon real estate, device designers and manufacturers have crossed into the third dimension. 3D IC technologies have jumped to the forefront of innovation in the microelectronics industry, touching every aspect of the supply chain from design to final test, with each step and process presenting unique challenges and opportunities.
3DIC technology is in the spotlight at SEMICON Europa, with technical sessions, keynote presentations, and exhibitors all dedicated to products, technologies, and solutions for 3DIC, including design, device fabrication, packaging, and test.

Exhibitors offering services for 3D IC
>3D IC and TSV Exhibitor list and search page

Conference related to 3D IC

>3D IC Session

>Advanced Packaging Manufacturing Conference
>International MEMS/MST Industry Forum

TechArena Presentations
>TechArena Agenda

Are you a supplier of the 3D/TSV equipment or materials? And not yet exhibiting?
Check out how you can easily join the Exhibitor community at SEMICON Europa.
>Details for exhibitors
>Pavilions and Turn-key Packages