As packaging, assembly and test in general, electronic systems for applications such as future mobility are targeting to find solutions for those key critical aspects of packaging and testing: Performance, Form-Factor and Cost.
Since the turn of the century Power semiconductors have become increasingly important as enabler for state-of-the-art consumer applications, industrial systems and, increasingly so, transportation vehicles and automobiles. Besides the challenges of power semiconductor manufacturing the test capabilities in particular for complex power analog semiconductors are playing a key enabling role for future products. New breakthrough methodologies are required.
The Advanced Packaging Conference as well the Power Electronics Conference will show presentations of experts from industry and research. In dedicated sessions you will get an update on the latest innovations and insights in the field of testing.
Focus of this year’s conferences:
- Wafer Final Test in the new era of electronics
- Probers for Wafer Level Packaging and MEMS sensors
- Test Floor Automation
- Challenges of testing complex power analog semiconductors
- Contact resistance in pulse conditions
Target group of this package are on the one hand Product- and Test Engineers. On the other hand, the sessions will discuss breakthrough methodologies, which impact test operations, also test-fab managers and decision makers should attend and participate.
Besides attending the formal sessions there are many opportunities to get together and discuss in an informal atmosphere the latest developments and experiences.
Price* Information and Registration
|Before 12 November||Onsite||Students|
* all Price information in EUR, VAT not included
In your Test Package is included:
> Advanced Packaging Conference
> Power Electronics Conference