APC–FMF Expo 2026

Messe Munich – International Conference Center (ICM), Foyer 1st Floor 
Wednesday, 11 November 2026
Day 2 of SEMICON Europa
08:00 – 19:00 CET (open to exhibitors & attendees) 

A Prime Sales & Networking Hotspot for 400+ Delegates

Secure your turnkey booth alongside two paid-access conferences—the Advanced Packaging Conference (Room 14a) and Fab Management Forum (Room 14c)—and connect with a 400+ delegate audience in the ICM Foyer.

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS)

Websites - APECS

Carl Zeiss Microscopy Deutschland GmbH

ZEISS is the only manufacturer worldwide offering light, X-ray, electron, and ion beam microscopy from a single source. With the most comprehensive imaging portfolio in the industry, ZEISS delivers cutting-edge solutions across the entire semiconductor value chain—from wafer fab to packaging and assembly. For mask making and lithography, ZEISS enables zero defect strategies, in-die metrology, and precise overlay control. Its process control and failure analysis tools provide actionable insights to meet the challenges of next-gen semiconductor devices. ZEISS combines innovation with reliability of optical excellence.

Websites -  Semiconductor Microscopy, Semiconductor Manufacturing Technology

COMET AG

Comet is a leading global provider of high-end X-ray-based system solutions for non-destructive materials testing in the semiconductor, electronics, automotive, and aerospace industries, as well as for research facilities and scientific institutions. Comet inspection solutions help users ensure the quality of their products, optimize their manufacturing processes, and thus increase efficiency and productivity.

The high-precision computed tomography systems for use in the laboratory support research and development and enable detailed structural analysis, metrology applications, and simulation models. The precise microfocus tubes reveal minute details of modern electronic components in the semiconductor and electronics industries. 

Websites - Comet

Kistler Instrumente AG

Kistler is the global market leader for dynamic pressure, force, torque and acceleration measurement technology. Unique sensor technology from this Swiss corporation helps to shape future innovations not only in automotive development and industrial automation but also in many newly emerging sectors. The focus is on issues such as electrified drive technology, autonomous driving, emission reduction and Industry 4.0. Some 2,000 employees at more than 60 facilities across the globe are dedicated to the development of new solutions, and they offer application-specific services at the local level. Ever since it was founded in 1959, the Kistler Group has grown hand-in-hand with its customers and in 2024, it posted sales of mCHF 448.

Website - Measurement systems and sensors | Kistler

SEMILAB

SEMILAB provides advanced metrology solutions, both in-line and R&D, for semiconductor device manufacturers. With its 45 product lines and 300+ unique products, Semilab offers a comprehensive suite of optical and electrical metrology solutions designed to ensure precision, reliability and efficiency and address the growing challenges of 3D structures, thin films, and advanced materials, helping advance the rapidly evolving field of Semiconductor Advanced Packaging and Panel Level Packaging.

Semilab’s metrology solutions provide advanced measurement capabilities for layer thickness, critical dimensions, defect detection, resistance and numerous other applications, ensuring optimal performance at the critical steps of the packaging process.

Website - Semilab

SEMI Europe

SEMI is a global industry association that represents the interests of the semiconductor industry's design, manufacturing, and supply chain businesses worldwide, offering various services and products.

One of the most popular products is the industry-recognized benchmark source for monthly semiconductor equipment market data and bi-annual equipment forecasts, such as market data and research reports covering semiconductor equipment, semiconductor materials, semiconductor packaging materials, electronic design market data, as well as wafer fab and packaging materials through SEMI’s Data Collection Programs and with industry partners.

To find out more information, you are welcome to visit us at the SEMI booth as well as review all the different and new reports on the SEMI website: Market Data Reports | SEMI 

Website - SEMI Europe

Spotfire

Spotfire is a visual industrial analytics platform that unifies process control and quality analytics across semiconductor fabrication environments. By analyzing high-volume, high-variety production data in a single platform, it gives fab managers AI-augmented visibility to make fast, confident decisions.

Teams can visualize wafer maps alongside process and equipment data, apply control limits, specification bands, and domain metrics directly to their analysis, and pinpoint root causes in minutes. The result: fewer defects, reduced scrap, higher yield, and millions in annual savings.

With interactive, semiconductor-specific visualizations, advanced analytics, and AI-augmented insights, Spotfire helps fabs sustain higher yields at scale.

Website - Spotfire

Sioux Technologies

Sioux Technologies is a privately owned high-tech systems integrator based in Eindhoven, with 1,300+ engineers in 11 offices across Europe and Asia. It develops, builds and assembles complex systems for OEMs, from concept to series production. For the semiconductor industry, Sioux offers building blocks around semiconductor-specific themes: applied AI, extreme positioning, inspection and analysis (pre-bond, nanometer alignment, post-bond IR/X-ray/SEM), system control and fab integration, and prototyping through series production. Sioux is unique in having the full stack in-house: software, mechatronics, optics, electronics, mathware and cleanroom assembly. One partner, from idea to volume, that accelerates innovation. 

Website - Sioux Technologies 

Syenta

Syenta develops Localized Electrochemical Manufacturing (LEM), an additive metallization technology for advanced packaging and substrates. LEM uses micron-resolution stamps to deposit copper only where it is needed, with RDL demonstrated at 1 µm line/space. Because the stamp defines each feature, LEM offers design flexibility in CD, pitch and height across the same layer, and is designed for uniform deposition on wafers as well as large panels.

Syenta focuses on high-density interconnects for AI and high-performance computing. The company is headquartered in Sydney, Australia, with operations in Europe and the US.

Website - Syenta

X-FAB MEMS Foundry GmbH

X-FAB MEMS Foundry is part of the X-FAB Group, the world’s leading analog/mixed-signal foundry, with more than 25 years of experience in integrating a wide range of functionalities such as non-volatile memory, optical sensors, MEMS, and high-voltage transistors. In addition to a broad portfolio of modular CMOS processes with geometries ranging from 0.35 to 0.11 micrometer, X-FAB offers specialized technologies such as SOI, silicon carbide (SiC), and MEMS processes. As a leading MEMS foundry, X-FAB MEMS Foundry provides process technologies for manufacturing micromechanical sensors for detecting pressure, acceleration, rotation, and infrared radiation, among others. It also offers integrated solutions where MEMS sensors are combined with CMOS circuits. In this context, comprehensive solutions for heterogeneous integration (HI) are offered or developed upon customer request for SoC and SoP applications. In Germany, X-FAB currently employs around 1,300 highly qualified staff. Worldwide, approximately 4,500 employees work for the company. Sales offices in key countries across Asia, Europe, and the USA ensure close contact with customers around the globe.

Website - X-FAB