Advanced Packaging Conference (APC)
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Power and Interconnects Innovations Enabling AI System Performance
Advanced packaging (AP) and test innovations are key to sustaining system-level performance scaling as traditional device scaling reaches its limits. In 2026, AP is central to next-generation electronics, enabling higher integration density, better power efficiency, and improved thermal and signal performance across HPC, AI, automotive, 5G/6G, and edge applications.
Through 2.5D/3D integration, chiplet architectures, heterogeneous integration, and advanced substrates and interconnects, the industry can significantly increase compute, bandwidth, and functionality while reducing power consumption. Innovations in materials, backside power delivery, fine-pitch interconnects, and chip–package–system co-design are becoming critical differentiators.
At the same time, sustainability and supply chain resilience are increasingly important, with a focus on lifecycle impact, resource efficiency, circularity, and regional manufacturing ecosystems. Advanced packaging is evolving from a back-end process into a strategic enabler of system architecture and value chain differentiation.
At this year’s Advanced Packaging Conference (APC), we bring together leading experts from academia, industry, and government to discuss the latest trends, challenges, and innovations shaping the field.
SEMI Europe Advanced Packaging Conference (APC) Committee:
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