Agenda at a Glance

At this year’s Advanced Packaging Conference (APC), we would like to present the latest advancements and innovations in these fields by bringing together leading experts, innovators, and stakeholders from academia, industry and government to explore the latest trends, challenges, and breakthroughs.

Embrace competitive, sustainable, and collaborative strategies to revolutionize fabs and semiconductor manufacturing in order to enhance the efficiency and performance by integrating cutting-edge technologies and fostering industry partnerships. In order to pave the way for a sustainable future with innovative solutions that meet the demands of the evolving market.

Explore how MEMS and imaging technologies innovations are driving the next generation of connectivity across various industries. Attendees will gain insights into cutting-edge developments, market trends, and ingenious utilization of AI/ML or data fusion, for new wave of groundbreaking applications.